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High-Purity Gold
Price on application
- Material
- High-purity gold (Au), supplied to specification
- Form
- Bonding wire, plating, sputtering target or thick-film paste
- Material
- Gold
Analysis
For bonding wire, wafer bumping and plating, sputtering targets and thick-film conductor pastes. Supplied to specification in the form and purity the application requires; independently analysed, with a certificate of analysis on request. Enquire for grades, forms and lead times.
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